IEC 60749-20 Ed. 3.0 b:2020 PDF

Name:
IEC 60749-20 Ed. 3.0 b:2020 PDF

Published Date:
08/01/2020

Status:
Active

Description:

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

Publisher:
International Electrotechnical Commission

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

This part of IEC 60749 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive.

Edition :	3.0
File Size :	1 file , 2.5 MB
ISBN(s) :	9782832287279
Note :	This product is unavailable in Ukraine, Russia, Belarus
Number of Pages :	60
Published :	08/01/2020

History

IEC 60749-20 Ed. 3.0 b:2020

Published Date: 08/01/2020

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

$70.2

IEC 60749-20 Ed. 2.0 b:2008

Published Date: 12/09/2008

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

$59.7

IEC 60749-20 Ed. 1.0 b CORR1:2003

Published Date: 08/13/2003

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat

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