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IEC 60749-20 Ed. 3.0 b:2020 PDF

IEC 60749-20 Ed. 3.0 b:2020 PDF

Name:
IEC 60749-20 Ed. 3.0 b:2020 PDF

Published Date:
08/01/2020

Status:
Active

Description:

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

Publisher:
International Electrotechnical Commission

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
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$70.2
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This part of IEC 60749 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive.


Edition : 3.0
File Size : 1 file , 2.5 MB
ISBN(s) : 9782832287279
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 60
Published : 08/01/2020

History

IEC 60749-20 Ed. 3.0 b:2020
IEC 60749-20 Ed. 3.0 b:2020
Published Date: 08/01/2020
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
$70.2
IEC 60749-20 Ed. 2.0 b:2008
IEC 60749-20 Ed. 2.0 b:2008
Published Date: 12/09/2008
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
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IEC 60749-20 Ed. 1.0 b CORR1:2003
IEC 60749-20 Ed. 1.0 b CORR1:2003
Published Date: 08/13/2003
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
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