IEC 60749-40 Ed. 1.0 b:2011 PDF

IEC 60749-40 Ed. 1.0 b:2011 PDF

Name:
IEC 60749-40 Ed. 1.0 b:2011 PDF

Published Date:
07/13/2011

Status:
Active

Description:

Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge

Publisher:
International Electrotechnical Commission

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

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IEC 60749-40:2011 is intended to evaluate and compare drop performance of a surface mount semiconductor device for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize test methodology to provide a reproducible assessment of the drop test performance of a surface mounted semiconductor devices while duplicating the failure modes normally observed during product level test. This international standard uses a strain gauge to measure the strain and strain rate of a board in the vicinity of a component.
Edition : 1.0
File Size : 1 file , 840 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 44
Published : 07/13/2011

History


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