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IEC 60191-6-2 Ed. 1.0 b:2001 PDF

IEC 60191-6-2 Ed. 1.0 b:2001 PDF

Name:
IEC 60191-6-2 Ed. 1.0 b:2001 PDF

Published Date:
12/11/2001

Status:
Active

Description:

Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

Publisher:
International Electrotechnical Commission

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$15.3
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IEC 60191-6-2:2001 covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball terminal packages, e.g. ceramic ball grid array (C-BGA), plastic ball grid array (P-BGA), tape ball grid array (T-BGA) and others as well as column terminal packages, e.g. ceramic column grid array (C-CGA).
Edition : 1.0
File Size : 1 file , 250 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 21
Published : 12/11/2001

History

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