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IEC 60749-9 Ed. 1.0 b:2002 PDF

IEC 60749-9 Ed. 1.0 b:2002 PDF

Name:
IEC 60749-9 Ed. 1.0 b:2002 PDF

Published Date:
04/12/2002

Status:
[ Withdrawn ]

Description:

Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking

Publisher:
International Electrotechnical Commission

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
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Choose Document Language:
$6.9
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Aims at testing and verifying that the markings on semiconductor devices will not become illegible when subject to solvents or cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board assembly process. This test is applicable for all package types. The test should be considered non-destructive.
Edition : 1.0
File Size : 1 file , 410 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 9
Published : 04/12/2002

History

IEC 60749-9 Ed. 2.0 b:2017
IEC 60749-9 Ed. 2.0 b:2017
Published Date: 03/03/2017
Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
$15.3
IEC 60749-9 Ed. 1.0 b CORR1:2003
IEC 60749-9 Ed. 1.0 b CORR1:2003
Published Date: 08/12/2003
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
Free Download
IEC 60749-9 Ed. 1.0 b:2002
IEC 60749-9 Ed. 1.0 b:2002
Published Date: 04/12/2002
Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
$6.9

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