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IEC 61189-2-808 Ed. 1.0 b:2024 PDF

IEC 61189-2-808 Ed. 1.0 b:2024 PDF

Name:
IEC 61189-2-808 Ed. 1.0 b:2024 PDF

Published Date:
04/01/2024

Status:
Active

Description:

Test Methods For Electrical Materials, Printed Board And Other Interconnection Structures And Assemblies - Part 2-808: Thermal Resistance Of An Assembly By Thermal Transient Method

Publisher:
International Electrotechnical Commission

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
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Choose Document Language:
$44.4
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This part of IEC 61189 describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source (e.g. power device), an attachment material (e.g. solder) and a dielectric layer with electrode. This method is suitable to determine the thermal resistance of materials and assembly methods as well as to optimize the thermal flux to a heat sink.

NOTE This method is not intended to measure and specify the value of the thermal resistance of a dielectric material. For that purpose, other standards exist. Examples are given in Annex A.


Edition : 1.0
File Size : 1 file , 2.7 MB
ISBN(s) : 9782832288047
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 44
Published : 04/01/2024

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