Name:
IEC 61189-2-808 Ed. 1.0 b:2024 PDF
Published Date:
04/01/2024
Status:
Active
Publisher:
International Electrotechnical Commission
This part of IEC 61189 describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source (e.g. power device), an attachment material (e.g. solder) and a dielectric layer with electrode. This method is suitable to determine the thermal resistance of materials and assembly methods as well as to optimize the thermal flux to a heat sink.
NOTE This method is not intended to measure and specify the value of the thermal resistance of a dielectric material. For that purpose, other standards exist. Examples are given in Annex A.
| Edition : | 1.0 |
| File Size : | 1 file , 2.7 MB |
| ISBN(s) : | 9782832288047 |
| Note : | This product is unavailable in Ukraine, Russia, Belarus |
| Number of Pages : | 44 |
| Published : | 04/01/2024 |
