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IEC 61190-1-2 Ed. 2.0 b:2007 PDF

IEC 61190-1-2 Ed. 2.0 b:2007 PDF

Name:
IEC 61190-1-2 Ed. 2.0 b:2007 PDF

Published Date:
04/26/2007

Status:
Active

Description:

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

Publisher:
International Electrotechnical Commission

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$36.3
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IEC 61190-1-2:2007 specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. The main changes with regard to the first edition concern a definition of lead-free solder alloy and an explanation of solder ball test standards.
Edition : 2.0
File Size : 1 file , 1.6 MB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 37
Published : 04/26/2007

History

IEC 61190-1-2 Ed. 3.0 b:2014
IEC 61190-1-2 Ed. 3.0 b:2014
Published Date: 02/19/2014
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
$57
IEC 61190-1-2 Ed. 2.0 b:2007
IEC 61190-1-2 Ed. 2.0 b:2007
Published Date: 04/26/2007
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
$36.3
IEC 61190-1-2 Ed. 2.0 en:2007
IEC 61190-1-2 Ed. 2.0 en:2007
Published Date: 04/26/2007
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
$29.1
IEC 61190-1-2 Ed. 1.0 b:2002
IEC 61190-1-2 Ed. 1.0 b:2002
Published Date: 03/22/2002
Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly
$20.1

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