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IEC 61190-1-2 Ed. 1.0 b:2002 PDF

IEC 61190-1-2 Ed. 1.0 b:2002 PDF

Name:
IEC 61190-1-2 Ed. 1.0 b:2002 PDF

Published Date:
03/22/2002

Status:
[ Withdrawn ]

Description:

Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly

Publisher:
International Electrotechnical Commission

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$20.1
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Specifies general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections in electronics assembly. Prescribes a quality control document (not intended to relate directly to the material performance in the manufacturing process).
Edition : 1.0
File Size : 1 file , 1.3 MB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 35
Published : 03/22/2002

History

IEC 61190-1-2 Ed. 3.0 b:2014
IEC 61190-1-2 Ed. 3.0 b:2014
Published Date: 02/19/2014
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
$57
IEC 61190-1-2 Ed. 2.0 b:2007
IEC 61190-1-2 Ed. 2.0 b:2007
Published Date: 04/26/2007
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
$36.3
IEC 61190-1-2 Ed. 2.0 en:2007
IEC 61190-1-2 Ed. 2.0 en:2007
Published Date: 04/26/2007
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
$29.1
IEC 61190-1-2 Ed. 1.0 b:2002
IEC 61190-1-2 Ed. 1.0 b:2002
Published Date: 03/22/2002
Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly
$20.1

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