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IEC 61190-1-2 Ed. 2.0 en:2007 PDF

IEC 61190-1-2 Ed. 2.0 en:2007 PDF

Name:
IEC 61190-1-2 Ed. 2.0 en:2007 PDF

Published Date:
04/26/2007

Status:
Active

Description:

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

Publisher:
International Electrotechnical Commission

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
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Choose Document Language:
$29.1
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Specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. Serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. Related information on flux characterization, quality control and procurement documentation for solder flux and flux containing material may be found in IEC 61190-1-1. The main changes with regard to the first edition concern a definition of lead-free solder alloy and an explanation of solder ball test standards.
Edition : 2.0
File Size : 1 file , 890 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 18
Published : 04/26/2007

History

IEC 61190-1-2 Ed. 3.0 b:2014
IEC 61190-1-2 Ed. 3.0 b:2014
Published Date: 02/19/2014
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
$57
IEC 61190-1-2 Ed. 2.0 b:2007
IEC 61190-1-2 Ed. 2.0 b:2007
Published Date: 04/26/2007
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
$36.3
IEC 61190-1-2 Ed. 2.0 en:2007
IEC 61190-1-2 Ed. 2.0 en:2007
Published Date: 04/26/2007
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
$29.1
IEC 61190-1-2 Ed. 1.0 b:2002
IEC 61190-1-2 Ed. 1.0 b:2002
Published Date: 03/22/2002
Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly
$20.1

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