IEC 61191-1 Ed. 2.0 b:2013 PDF

IEC 61191-1 Ed. 2.0 b:2013 PDF

Name:
IEC 61191-1 Ed. 2.0 b:2013 PDF

Published Date:
05/21/2013

Status:
[ Withdrawn ]

Description:

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

Publisher:
International Electrotechnical Commission

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

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$84.3
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IEC 61191-1:2013 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. It also includes recommendations for good manufacturing processes. This edition includes the following significant technical changes with respect to the previous edition:
- reference standard IEC 61192-1 has been replaced by IPC-A-610;
- some of the terminology has been updated;
- references to IEC standards have been corrected;
- the use of lead-free alloys in the assembly have been added.
Edition : 2.0
File Size : 1 file , 790 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 96
Published : 05/21/2013

History

IEC 61191-1 Ed. 3.0 b:2018
Published Date: 09/14/2018
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
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IEC 61191-1 Ed. 2.0 b:2013
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Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
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IEC 61191-1 Ed. 1.0 b:1998
Published Date: 08/28/1998
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
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