IEC 61192-5 Ed. 1.0 b:2007 PDF

IEC 61192-5 Ed. 1.0 b:2007 PDF

Name:
IEC 61192-5 Ed. 1.0 b:2007 PDF

Published Date:
05/23/2007

Status:
Active

Description:

Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies

Publisher:
International Electrotechnical Commission

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

SKU:

Choose Document Language:
$70.5
Need Help?
IEC 61192-5:2007 provides information and requirements that are applicable to modification, rework and repair procedures for soldered electronic assemblies. It is applicable to specific processes used to manufacture soldered electronic assemblies where components are attached to printed boards and to the relevant parts of resulting products. The standard is also applicable to activities that can form part of the work in assembling mixed technology products. It also contains guidance on design matters where they have relevance to rework.
Edition : 1.0
File Size : 1 file , 1.3 MB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 80
Published : 05/23/2007

History

IEC 61192-5 Ed. 1.0 b:2008
Published Date: 05/14/2008
Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies
$47.4
IEC 61192-5 Ed. 1.0 en:2007
Published Date: 05/23/2007
Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies
$44.1
IEC 61192-5 Ed. 1.0 b:2007
Published Date: 05/23/2007
Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies
$70.5

Related products

IEC 61188-5-6 Ed. 1.0 b:2003
Published Date: 01/23/2003
Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
$43.5
IEC 61190-1-3 Ed. 2.0 b:2007
Published Date: 04/26/2007
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
$70.5
IEC 61191-2 Ed. 3.0 b:2017
Published Date: 05/23/2017
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
$83.4

Best-Selling Products