Low prices! Originals & Translations! Save your budget and time!
ONLINENORMS: Online Standards Store
Click View Shopping Cart
  1. Home
  2. IEC
  3. IEC 62137 Ed. 1.0 b:2004 PDF

IEC 62137 Ed. 1.0 b:2004 PDF

IEC 62137 Ed. 1.0 b:2004 PDF

Name:
IEC 62137 Ed. 1.0 b:2004 PDF

Published Date:
07/06/2004

Status:
[ Withdrawn ]

Description:

Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN

Publisher:
International Electrotechnical Commission

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$61.8
Need Help?
This International Standard specifies the test method and guidelines for evaluating the quality and reliability of boards, solder lands, solder process and solder joints of reflow solder mounted area array type packages and peripheral terminal type packages. This standard tests for durability against mechanical and thermal stress received during or after the mounting process of discrete semiconductor devices and of integrated circuits (hereinafter both referred to as semiconductor devices) used mainly for industrial and consumer use equipment.
Edition : 1.0
File Size : 1 file , 1.1 MB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 57
Published : 07/06/2004

History

IEC 62137 Ed. 1.0 b:2005
IEC 62137 Ed. 1.0 b:2005
Published Date: 02/14/2005
Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
$38.4
IEC 62137 Ed. 1.0 b:2004
IEC 62137 Ed. 1.0 b:2004
Published Date: 07/06/2004
Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
$61.8

Related products

IEC 61188-5-6 Ed. 1.0 b:2003
IEC 61188-5-6 Ed. 1.0 b:2003
Published Date: 01/23/2003
Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
$43.5
IEC 60068-2-82 Ed. 2.0 b:2019
IEC 60068-2-82 Ed. 2.0 b:2019
Published Date: 05/14/2019
Environmental testing - Part 2-82: Tests - Test Xw1: Whisker test methods for components and parts used in electronic assemblies
$83.4
IEC 62137-1-2 Ed. 1.0 b:2008
IEC 62137-1-2 Ed. 1.0 b:2008
Published Date: 05/14/2008
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
$26.1
IEC 60068-2-69 Ed. 3.1 b:2019
IEC 60068-2-69 Ed. 3.1 b:2019
Published Date: 06/19/2019
Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method CONSOLIDATED EDITION
$159.3

Best-Selling Products

NEMA/MITA CSP 2-2021
NEMA/MITA CSP 2-2021
Published Date: 2021
Lifecycle Best Practices Framework for Medical Imaging Devices
$14.7
NEMA/MITA DD P1-2019
NEMA/MITA DD P1-2019
Published Date: 08/01/2019
White Paper on Understanding the Limited Usefulness of Detector Dose Measurements in Modern Medical X-ray Imaging Equipment
$24.6
NEMA/MITA RMD P1-2019
NEMA/MITA RMD P1-2019
Published Date: 01/30/2019
White Paper on Considerations for Remanufacturing of Medical Imaging Devices
$14.7
NEMA/MITA RSSTCD 1-2019
NEMA/MITA RSSTCD 1-2019
Published Date: 2019
White Paper on Radiation Safety Specification and Testing Comparison Document for Medical X-Ray Imaging Devices General Radiography and Fluoroscopy, and Interventional Fluoroscopy
$28.8
NEMA/MITA RSSTCD 2-2020
NEMA/MITA RSSTCD 2-2020
Published Date: 2020
White Paper on 21 CFR Subchapter J to IEC Comparison Table for Medical X-Ray Imaging Devices Mammography
$30
NEMA/MITA SAC 1-2020
NEMA/MITA SAC 1-2020
Published Date: 2020
White Paper on Understanding Accountability in Medical Device Servicing
$14.7