Low prices! Originals & Translations! Save your budget and time!
ONLINENORMS: Online Standards Store
Click View Shopping Cart
  1. Home
  2. IEC
  3. IEC 62880-1 Ed. 1.0 en:2017 PDF

IEC 62880-1 Ed. 1.0 en:2017 PDF

IEC 62880-1 Ed. 1.0 en:2017 PDF

Name:
IEC 62880-1 Ed. 1.0 en:2017 PDF

Published Date:
08/23/2017

Status:
Active

Description:

Semiconductor devices - Stress migration test standard - Part 1: Copper stress migration test standard

Publisher:
International Electrotechnical Commission

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$57
Need Help?
IEC 62880-1:2017(E) describes a constant temperature (isothermal) aging method for testing copper (Cu) metallization test structures on microelectronics wafers for susceptibility to stress-induced voiding (SIV). This method is to be conducted primarily at the wafer level of production during technology development, and the results are to be used for lifetime prediction and failure analysis. Under some conditions, the method can be applied to package-level testing. This method is not intended to check production lots for shipment, because of the long test time.
Edition : 1.0
File Size : 1 file , 970 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 24
Published : 08/23/2017

History

Related products

IEC 60749-27 Ed. 2.0 b:2006
IEC 60749-27 Ed. 2.0 b:2006
Published Date: 07/18/2006
Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)
$28.5
IEC 60749-35 Ed. 1.0 b:2006
IEC 60749-35 Ed. 1.0 b:2006
Published Date: 07/18/2006
Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components
$57
IEC 60749-39 Ed. 2.0 b:2021
IEC 60749-39 Ed. 2.0 b:2021
Published Date: 11/01/2021
Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
$28.5
IEC 60191-2Y Ed. 1.0 b:2000
IEC 60191-2Y Ed. 1.0 b:2000
Published Date: 06/16/2000
Twenty-third supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions
$57

Best-Selling Products

Combined-Cycle Gas & Steam Turbine Power Plants
Combined-Cycle Gas & Steam Turbine Power Plants
Published Date: 04/01/1999
$27
Petroleum Engineering Handbook for the Practicing Engineer
Petroleum Engineering Handbook for the Practicing Engineer
Published Date: 01/01/1992
Petroleum Refining for the NonTechnical Person
Petroleum Refining for the NonTechnical Person
Published Date: 01/01/1985
$19.5
Petroleum Refining in Nontechnical Language
Petroleum Refining in Nontechnical Language
Published Date: 03/01/2000
$20.4
SCR & New Technology in Electric Rig Drilling : A Safety & Efficiency Handbook
SCR & New Technology in Electric Rig Drilling : A Safety & Efficiency Handbook
Published Date: 01/01/1991
$7.5
Troubleshooting Process Operations
Troubleshooting Process Operations
Published Date: 01/01/1991
$28.5