Name:
IEC 63378-2-1 Ed. 1.0 en:2024 PDF
Published Date:
10/01/2024
Status:
Active
Publisher:
International Electrotechnical Commission
This part of IEC 63378 specifies three-dimensional (3D) thermal models of discrete semiconductor packages (TO-243, TO-252 and TO-263), utilized in the steady-state thermal analysis of electronic devices to estimate junction temperatures accurately.
This model is assumed to be made by semiconductor suppliers and to be used by assembly makers of electronic devices.
| Edition : | 1.0 |
| File Size : | 1 file , 1.1 MB |
| ISBN(s) : | 9782832298169 |
| Note : | This product is unavailable in Ukraine, Russia, Belarus |
| Number of Pages : | 20 |
| Published : | 10/01/2024 |
