New IEEE Standard - Active.
IEEE Std 1838 is a die-centric standard; it applies to a die that is intended to be part of a multi-die stack. This standard defines die-level features that, when compliant dies are brought together in a stack, comprise a stack-level architecture that enables transportation of control and data signals for the test of (1) intra-die circuitry and (2) inter-die interconnects in both (a) pre-stacking and (b) post-stacking situations, the latter for both partial and complete stacks in both pre-packaging, post-packaging, and board-level situations. The primary focus of inter-die interconnect technology addressed by this standard is through-silicon vias (TSVs); however, this does not preclude its use with other interconnect technologies such as wire-bonding
| File Size : | 1
file
, 3.8 MB |
| ISBN(s) : | 9781504465526, 9781504463430, 9781504463447 |
| Note : | This product is unavailable in Russia, Ukraine, Belarus |
| Number of Pages : | 0 |
| Product Code(s) : | STD23997, STDPD23997, STDPL23997 |
| Published : | 03/13/2020 |
