This new document provides guides for the design and fabrication of stencils for solder paste and
surface-mount adhesive. This is the first time this important information has been collected and
published in an industry consensus document. Stencil design for various surface-mount
technology, as well as mixed technology with through-hole or flip chip components is discussed;
this includes overprint, two-print and step stencil designs. A sample order form and a user
inspection checklist are also included.
| File Size : | 1
file
, 330 KB |
| Note : | This product is unavailable in Russia, Ukraine, Belarus |
| Number of Pages : | 20 |
| Product Code(s) : | 7525(D)1 |
| Published : | 05/01/2000 |
