Now includes support for stencils used with lead free processes.
This document provides guidelines for the design and fabrication of stencils for solder paste and surface-mount adhesive. Stencil design for various surface-mount technology, as well as mixed technology with through-hole or flip chip components is discussed. This includes differences for tin lead and lead free solder paste, overprint, two-print and step stencil designs. A sample order form and user inspection checklist are also included.
| File Size : | 1
file
, 800 KB |
| Note : | This product is unavailable in Russia, Ukraine, Belarus |
| Number of Pages : | 28 |
| Published : | 02/01/2007 |
