IPC 7621 PDF

IPC 7621 PDF

Name:
IPC 7621 PDF

Published Date:
01/01/2018

Status:
[ Withdrawn ]

Description:

Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics

Publisher:
Association Connecting Electronics Industries

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

SKU:

Choose Document Language:
$54.6
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Encapsulation, for the purpose of IPC 7621, is defined as a low pressure molded thermoplastic, e.g., polyamide, which is brought to a liquid state and injection molded and (rather quickly) returned to a temperature below its melting point, forming a durable yet pliable (rubbery-like) form. The desired performance characteristics of LPM encapsulation depend on the application and must be considered when selecting material. Users are urged to consult material suppliers for detailed technical data. This guide will aid the user in understanding the capabilities and limits of LPM using thermoplastics.
File Size : 1 file , 2.7 MB
ISBN(s) : 9781611933451
Note : This product is unavailable in Russia, Belarus
Number of Pages : 40
Product Code(s) : 7621-STD-0-P-0-EN-0
Published : 01/01/2018

History


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