IPC A-20/21-GKIT PDF

Name:
IPC A-20/21-GKIT PDF

Published Date:

Status:
Active

Description:

Standard Pitch Stencil Pattern for Slump Evaluation (Electronic Gerber Files)

Publisher:
Association Connecting Electronics Industries

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

Provided electronically, these Gerber Files include patterns for developing solder paste stencils by lasar or chemical etching. Land widths of 0.4 mm, 0.63mm and 1.25 mm are provided with varying pitch in order to evaluate solder paste slump.

Note :

This product is unavailable in Russia, Ukraine, Belarus

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