This standard prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs and tabs. A test method for the resistance to dissolution/dewetting of metallization is also included in the standard. Intended for use by both vendors and users, J-STD-002D was developed by EIA, IPC and JEDEC.
| File Size : | 1
file
, 2 MB |
| Note : | This product is unavailable in Russia, Ukraine, Belarus |
| Number of Pages : | 64 |
| Published : | 06/01/2013 |
