Updated & ANSI Approved! This standard identifies the classification level of nonhermetic solid state surface mount devices that are sensitive to moisture-induced stress. This standard now covers components to be processed at higher temperatures for lead-free assembly. It is used to determine what classification level should be used for initial reliability qualification. These devices can be properly packaged, stored, and handled to avoid subsequent thermal/mechanical damage during solder reflow attachment and/or repair operation. Developed by IPC and JEDEC.
| File Size : | 1
file
, 130 KB |
| Note : | This product is unavailable in Russia, Ukraine, Belarus |
| Number of Pages : | 12 |
| Published : | 07/01/2002 |
