Updated with extended support for components used for lead free assembly! This standard identifies the classification levels of nonhermetic solid state surface mount devices that are sensitive to moisture-induced stress. It is used to determine which classification level should be used for initial reliability qualification. These devices can be properly packaged, stored, and handled to avoid subsequent thermal/mechanical damage during solder reflow attachment. Developed by IPC and JEDEC.
| File Size : | 1
file
, 200 KB |
| Note : | This product is unavailable in Russia, Ukraine, Belarus |
| Number of Pages : | 13 |
| Published : | 08/01/2007 |
