The purpose of this standard is to identify the classification level of non-hermetic solid state surface mount devices that are sensitive to moisture-induced stress. They can be properly packaged, stored, and handled to avoid subsequent thermal/mechanical damage during the assembly solder reflow attachment and/or repair operation. This standard is used to determine what classification level should be used for initial reliability qualification.
| Note : | This product is unavailable in Russia, Ukraine, Belarus |
| Number of Pages : | 20 |
| Part of : | IPC M109 |
| Published : | 04/01/1999 |
