IPC J-STD-027 PDF

Name:
IPC J-STD-027 PDF

Published Date:
02/01/2003

Status:
Active

Description:

Mechanical Outline Standard for Flip Chip or Chip Scale Configurations

Publisher:
Association Connecting Electronics Industries

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

THis standard establishes mechanical outline requirements for devices supplied in flip chip or CHip Size Package (CSP) formats. including die surface, die terminals, and interconnection balls/bumps/lands to the next level.

File Size :	1 file , 90 KB
Note :	This product is unavailable in Russia, Ukraine, Belarus
Number of Pages :	20
Product Code(s) :	J-027(D)1, J-027(D)1
Published :	02/01/2003