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JEDEC J-STD-033C PDF

JEDEC J-STD-033C PDF

Name:
JEDEC J-STD-033C PDF

Published Date:
12/01/2011

Status:
Active

Description:

JOINT IPC/JEDEC STANDARD FOR HANDLING, PACKING, SHIPPING AND USE OF MOISTURE/REFLOW SENSITIVE SURFACE-MOUNT DEVICES

Publisher:
JEDEC Solid State Technology Association

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$22.2
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The advent of surface mount devices (SMDs) introduced a new class of quality and reliability concerns regarding damage from the solder reflow process, such as cracks and delamination. This document describes the standardized levels of floorlife exposure for moisture/reflow sensitive SMDs along with the handling, packing, and shipping requirements necessary to avoid moisture/reflow related failures. Companion documents J-STD-020 and J-STD-075 define the classification procedure and JEP113 defines the labeling requirements.
File Size : 1 file , 500 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 18
Published : 12/01/2011

History

JEDEC J-STD-033D
JEDEC J-STD-033D
Published Date: 04/02/2018
Handling, Packing, Shipping, and Use of Moisture/Reflow Sensitive Surface-Mount Devices
$26.7
JEDEC J-STD-033D
JEDEC J-STD-033D
Published Date: 04/01/2018
Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
$23.7
JEDEC J-STD-033C
JEDEC J-STD-033C
Published Date: 12/01/2011
JOINT IPC/JEDEC STANDARD FOR HANDLING, PACKING, SHIPPING AND USE OF MOISTURE/REFLOW SENSITIVE SURFACE-MOUNT DEVICES
$22.2
JEDEC J-STD-033B.1
JEDEC J-STD-033B.1
Published Date: 01/01/2007
JOINT IPC/JEDEC STANDARD FOR HANDLING, PACKING, SHIPPING AND USE OF MOISTURE/REFLOW SENSITIVE SURFACE-MOUNT DEVICES
$20.1
JEDEC JEP113-B
JEDEC JEP113-B
Published Date: 05/01/1999
SYMBOL AND LABELS FOR MOISTURE-SENSITIVE DEVICES

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