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JEDEC J-STD-033D PDF

JEDEC J-STD-033D PDF

Name:
JEDEC J-STD-033D PDF

Published Date:
04/02/2018

Status:
Active

Description:

Handling, Packing, Shipping, and Use of Moisture/Reflow Sensitive Surface-Mount Devices

Publisher:
JEDEC Solid State Technology Association

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$26.7
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The purpose of this document is to provide manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow and process sensitive devices that have been classified to the levels defined in J-STD-020 or J-STD-075. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe and damage-free reflow can be achieved. The dry-packing process defined herein provides a minimum shelf life of 12 months from the seal date.
File Size : 1 file , 1.1 MB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 31
Published : 04/02/2018

History

JEDEC J-STD-033D
JEDEC J-STD-033D
Published Date: 04/02/2018
Handling, Packing, Shipping, and Use of Moisture/Reflow Sensitive Surface-Mount Devices
$26.7
JEDEC J-STD-033D
JEDEC J-STD-033D
Published Date: 04/01/2018
Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
$23.7
JEDEC J-STD-033C
JEDEC J-STD-033C
Published Date: 12/01/2011
JOINT IPC/JEDEC STANDARD FOR HANDLING, PACKING, SHIPPING AND USE OF MOISTURE/REFLOW SENSITIVE SURFACE-MOUNT DEVICES
$22.2
JEDEC J-STD-033B.1
JEDEC J-STD-033B.1
Published Date: 01/01/2007
JOINT IPC/JEDEC STANDARD FOR HANDLING, PACKING, SHIPPING AND USE OF MOISTURE/REFLOW SENSITIVE SURFACE-MOUNT DEVICES
$20.1
JEDEC JEP113-B
JEDEC JEP113-B
Published Date: 05/01/1999
SYMBOL AND LABELS FOR MOISTURE-SENSITIVE DEVICES

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