JEDEC JESD217 PDF

JEDEC JESD217 PDF

Name:
JEDEC JESD217 PDF

Published Date:
09/01/2010

Status:
Active

Description:

TEST METHODS TO CHARACTERIZE VOIDING IN PRE-SMT BALL GRID ARRAY PACKAGES

Publisher:
JEDEC Solid State Technology Association

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

This publication provides an overview of solder void types, outlines current metrologies and test methods used for pre-SMPT solder void characterization and potential limitations, and prescribes sampling strategy for data collection, and tolerance guidelines for corrective measures.

File Size :	1 file , 1.8 MB
Note :	This product is unavailable in Ukraine, Russia, Belarus
Number of Pages :	44
Published :	09/01/2010

History

Published Date: 11/01/2022

Test Methods to Characterize Voiding in Pre-SMT Ball Grid Array Packages

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Published Date: 10/01/2022

Test Methods to Characterize Voiding in Pre-SMT Ball Grid Array Packages

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Published Date: 09/01/2010

TEST METHODS TO CHARACTERIZE VOIDING IN PRE-SMT BALL GRID ARRAY PACKAGES

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