Name:
JEDEC JESD217A PDF
Published Date:
10/01/2022
Status:
Active
Publisher:
JEDEC Solid State Technology Association
This publication provides an overview of solder void types, outlines current metrologies and test methods used for pre-SMPT solder void characterization and potential limitations, and prescribes sampling strategy for data collection, and tolerance guidelines for corrective measures.
| File Size : | 1 file , 2.4 MB |
| Note : | This product is unavailable in Ukraine, Russia, Belarus |
| Number of Pages : | 48 |
| Published : | 10/01/2022 |
