JEDEC JESD217A PDF

JEDEC JESD217A PDF

Name:
JEDEC JESD217A PDF

Published Date:
11/01/2022

Status:
Active

Description:

Test Methods to Characterize Voiding in Pre-SMT Ball Grid Array Packages

Publisher:
JEDEC Solid State Technology Association

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Czech version):

200 business days

SKU:

jedec-jesd217a_2504631

This publication provides an overview of solder void types, outlines current metrologies and test methods used for pre-SMPT solder void characterization and potential limitations, and prescribes sampling strategy for data collection, and tolerance guidelines for corrective measures.

File Size :	1 file , 2.2 MB
Note :	This product is unavailable in Ukraine, Russia, Belarus
Number of Pages :	48
Published :	11/01/2022

History

Published Date: 11/01/2022

Test Methods to Characterize Voiding in Pre-SMT Ball Grid Array Packages

Published Date: 10/01/2022

Test Methods to Characterize Voiding in Pre-SMT Ball Grid Array Packages

Published Date: 09/01/2010

TEST METHODS TO CHARACTERIZE VOIDING IN PRE-SMT BALL GRID ARRAY PACKAGES

24.00 €

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