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JEDEC JESD217A PDF

JEDEC JESD217A PDF

Name:
JEDEC JESD217A PDF

Published Date:
11/01/2022

Status:
Active

Description:

Test Methods to Characterize Voiding in Pre-SMT Ball Grid Array Packages

Publisher:
JEDEC Solid State Technology Association

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
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This publication provides an overview of solder void types, outlines current metrologies and test methods used for pre-SMPT solder void characterization and potential limitations, and prescribes sampling strategy for data collection, and tolerance guidelines for corrective measures.


File Size : 1 file , 2.2 MB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 48
Published : 11/01/2022

History

JEDEC JESD217A
JEDEC JESD217A
Published Date: 11/01/2022
Test Methods to Characterize Voiding in Pre-SMT Ball Grid Array Packages
Free Download
JEDEC JESD217A
JEDEC JESD217A
Published Date: 10/01/2022
Test Methods to Characterize Voiding in Pre-SMT Ball Grid Array Packages
Free Download
JEDEC JESD217
JEDEC JESD217
Published Date: 09/01/2010
TEST METHODS TO CHARACTERIZE VOIDING IN PRE-SMT BALL GRID ARRAY PACKAGES
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