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JEDEC JESD22-A111B PDF

JEDEC JESD22-A111B PDF

Name:
JEDEC JESD22-A111B PDF

Published Date:
03/01/2018

Status:
Active

Description:

EVALUATION PROCEDURE FOR DETERMINING CAPABILITY TO BOTTOM SIDE BOARD ATTACH BY FULL BODY SOLDER IMMERSION OF SMALL SURFACE MOUNT SOLID STATE DEVICES

Publisher:
JEDEC Solid State Technology Association

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Czech version):
200 business days
SKU:
jedec-jesd22-a111b_2010422
Choose Document Language:
18.60 €
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The purpose of this test method is to identify the potential wave solder classification level of small plastic Surface Mount Devices (SMDs) that are sensitive to moisture-induced stress so that they can be properly packaged, stored, and handled to avoid subsequent mechanical damage during the assembly wave solder attachment and/or repair operations. This test method also provides a reliability preconditioning sequence for small SMDs that are wave soldered using full body immersion. This test method, may be used by users to determine what classification level should be used for initial board level reliability qualification.
File Size : 1 file , 340 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 22
Published : 03/01/2018

History

JEDEC JESD22-A111B
JEDEC JESD22-A111B
Published Date: 03/01/2018
EVALUATION PROCEDURE FOR DETERMINING CAPABILITY TO BOTTOM SIDE BOARD ATTACH BY FULL BODY SOLDER IMMERSION OF SMALL SURFACE MOUNT SOLID STATE DEVICES
18.60 €
JEDEC JESD22-A111A
JEDEC JESD22-A111A
Published Date: 11/01/2010
EVALUATION PROCEDURE FOR DETERMINING CAPABILITY TO BOTTOM SIDE BOARD ATTACH BY FULL BODY SOLDER IMMERSION OF SMALL SURFACE MOUNT SOLID STATE DEVICES
17.70 €
JEDEC JESD 22-A111
JEDEC JESD 22-A111
Published Date: 05/01/2004
EVALUATION PROCEDURE FOR DETERMINING CAPABILITY TO BOTTOM SIDE BOARD ATTACH BY FULL BODY SOLDER IMMERSION OF SMALL SURFACE MOUNT SOLID STATE DEVICES
17.70 €

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