Low prices! Originals & Translations! Save your budget and time!
ONLINENORMS: Online Standards Store
Click View Shopping Cart
  1. Home
  2. JEDEC
  3. JEDEC JESD22-A111A PDF

JEDEC JESD22-A111A PDF

JEDEC JESD22-A111A PDF

Name:
JEDEC JESD22-A111A PDF

Published Date:
11/01/2010

Status:
Active

Description:

EVALUATION PROCEDURE FOR DETERMINING CAPABILITY TO BOTTOM SIDE BOARD ATTACH BY FULL BODY SOLDER IMMERSION OF SMALL SURFACE MOUNT SOLID STATE DEVICES

Publisher:
JEDEC Solid State Technology Association

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$17.7
Need Help?
The purpose of this test method is to identify the potential wave solder classification level of small plastic Surface Mount Devices (SMDs) that are sensitive to moisture-induced stress so that they can be properly packaged, stored, and handled to avoid subsequent mechanical damage during the assembly wave solder attachment and/or repair operations. This test method also provides a reliability preconditioning sequence for small SMDs that are wave soldered using full body immersion. This test method, may be used by users to determine what classification level should be used for initial board level reliability qualification.
File Size : 1 file , 64 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 18
Published : 11/01/2010

History

JEDEC JESD22-A111B
JEDEC JESD22-A111B
Published Date: 03/01/2018
EVALUATION PROCEDURE FOR DETERMINING CAPABILITY TO BOTTOM SIDE BOARD ATTACH BY FULL BODY SOLDER IMMERSION OF SMALL SURFACE MOUNT SOLID STATE DEVICES
$18.6
JEDEC JESD22-A111A
JEDEC JESD22-A111A
Published Date: 11/01/2010
EVALUATION PROCEDURE FOR DETERMINING CAPABILITY TO BOTTOM SIDE BOARD ATTACH BY FULL BODY SOLDER IMMERSION OF SMALL SURFACE MOUNT SOLID STATE DEVICES
$17.7
JEDEC JESD 22-A111
JEDEC JESD 22-A111
Published Date: 05/01/2004
EVALUATION PROCEDURE FOR DETERMINING CAPABILITY TO BOTTOM SIDE BOARD ATTACH BY FULL BODY SOLDER IMMERSION OF SMALL SURFACE MOUNT SOLID STATE DEVICES
$17.7

Related products

JEDEC JEP140 (R2006)
JEDEC JEP140 (R2006)
Published Date: 06/01/2002
BEADED THERMOCOUPLE TEMPERATURE MEASUREMENT OF SEMICONDUCTOR PACKAGES
$16.2
JEDEC JESD22-A114F
JEDEC JESD22-A114F
Published Date: 12/01/2008
ELECTROSTATIC DISCHARGE (ESD) SENSITIVITY TESTING HUMAN BODY MODEL (HBM)
$18.6
JEDEC JESD22-B108B
JEDEC JESD22-B108B
Published Date: 09/01/2010
COPLANARITY TEST FOR SURFACE-MOUNT SEMICONDUCTOR DEVICES
$15.9

Best-Selling Products

IEEE/ISO 10857-1994
IEEE/ISO 10857-1994
Published Date: 04/27/1994
ISO/IEC/IEEE International Standard - Information Technology -- Microprocessor Systems -- Futurebus+(R) - Logical Protocol specification
$80.7
IEEE/ISO 11073-10101:2004/Amd 1:2017
IEEE/ISO 11073-10101:2004/Amd 1:2017
Published Date: 10/01/2017
Health informatics -- Point-of-care medical device communication -- Part 10101: Nomenclature/Amd 1:2017
IEEE/ISO 11073-10101-2004/Amd 1-2017
IEEE/ISO 11073-10101-2004/Amd 1-2017
Published Date: 03/26/2018
ISO/IEEE International Standard - Health informatics -- Point-of-care medical device communication -- Part 10101: Nomenclature AMENDMENT 1: Additional definitions
$47.7
IEEE/ISO 11073-10101-2004
IEEE/ISO 11073-10101-2004
Published Date: 12/15/2004
ISO/IEEE Health informatics -- Point-of-care medical device communication -- Part 10101: Nomenclature
$129.3
IEEE/ISO 11073-10101-2020
IEEE/ISO 11073-10101-2020
Published Date: 08/28/2020
ISO/IEEE International Standard - Health informatics-Device interoperability-Part 10101: Point-of-care medical device communication-Nomenclature
$108
IEEE/ISO 11073-10206-2024
IEEE/ISO 11073-10206-2024
Published Date: 08/07/2024
ISO/IEEE International Standard--Health informatics--Device interoperability--Part 10206: Personal health device communication--Abstract content information model
$31.8