Name:
JEDEC JESD22-B112C PDF
Published Date:
11/01/2023
Status:
Active
Publisher:
JEDEC Solid State Technology Association
The purpose of this test method is to measure the deviation from uniform flatness of an integrated circuit package body for the range of thermal conditions experienced during the surface-mount soldering operation.
| File Size : | 1 file , 1.9 MB |
| Note : | This product is unavailable in Russia, Belarus |
| Published : | 11/01/2023 |
