JEDEC JESD22-B112C PDF

Name: JEDEC JESD22-B112C PDF
Brand: JEDEC Solid State Technology Association
SKU: jedec-jesd22-b112c_2577472

Name:
JEDEC JESD22-B112C PDF

Published Date:
11/01/2023

Status:
Active

Description:

Package Warpage Measurement of Surface-Mount Integrated Circuits at Elevated Temperature

Publisher:
JEDEC Solid State Technology Association

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Czech version):

200 business days

SKU:

jedec-jesd22-b112c_2577472

The purpose of this test method is to measure the deviation from uniform flatness of an integrated circuit package body for the range of thermal conditions experienced during the surface-mount soldering operation.

File Size :	1 file , 1.9 MB
Note :	This product is unavailable in Russia, Belarus
Published :	11/01/2023

History

JEDEC JESD22-B112C

Published Date: 11/01/2023

Package Warpage Measurement of Surface-Mount Integrated Circuits at Elevated Temperature

JEDEC JESD22-B112A

Published Date: 10/01/2009

PACKAGE WARPAGE MEASUREMENT OF SURFACE-MOUNT INTEGRATED CIRCUITS AT ELEVATED TEMPERATURE

22.20 €

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