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JEDEC JESD51-10 PDF

JEDEC JESD51-10 PDF

Name:
JEDEC JESD51-10 PDF

Published Date:
07/01/2000

Status:
Active

Description:

TEST BOARDS FOR THROUGH-HOLE PERIMETER LEADED PACKAGE THERMAL MEASUREMENTS

Publisher:
JEDEC Solid State Technology Association

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
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Choose Document Language:
$16.8
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This standard covers the design of printed circuit boards (PCBs) used in the thermal characterization of Dual-Inline Packages (DIP) and Single-Inline Packages (SIP). It is intended to be used in conjunction with the JESD51 series of standards that cover the test methods and test environments. JESD51-10 was developed to give a figure-of-merit of thermal performance that allows for accurate comparisons of packages from different suppliers. It can be used to give a first order approximation of system performance and, in conjunction with the other JESD51 PCB standards, allows for comparisons of the various package families.
File Size : 1 file , 100 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 16
Published : 07/01/2000

History

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