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JEDEC JESD51-11 PDF

JEDEC JESD51-11 PDF

Name:
JEDEC JESD51-11 PDF

Published Date:
06/01/2001

Status:
Active

Description:

TEST BOARDS FOR THROUGH-HOLE AREA ARRAY LEADED PACKAGE THERMAL MEASUREMENT

Publisher:
JEDEC Solid State Technology Association

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$17.7
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This standard covers the design of printed circuit boards (PCBs) used in the thermal characterization of Pin Grid Array (PGA) packages. It is intended to be used in conjunction with the JESD51 series of standards that cover the test methods and test environments. JESD51-11 was developed to give a figure-of-merit of thermal performance that allows for accurate comparisons of packages from different suppliers. It can be used to give a first order approximation of system performance and, in conjunction with the other JESD51 PCB standards, allows for comparisons of the various package families.
File Size : 1 file , 210 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 17
Published : 06/01/2001

History

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