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JEDEC JESD51 PDF

JEDEC JESD51 PDF

Name:
JEDEC JESD51 PDF

Published Date:
12/01/1995

Status:
Active

Description:

METHODOLOGY FOR THE THERMAL MEASUREMENT OF COMPONENT PACKAGES (SINGLE SEMICONDUCTOR DEVICE)

Publisher:
JEDEC Solid State Technology Association

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$15.3
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This standard and its subsequent addendum's, provides a standard for thermal measurement that, if followed fully, will provide correct and meaningful data that will allow for determination of junction temperature for specific conditions. The data can be used for package design evaluation, device characterization and reliability predictions.
File Size : 1 file , 150 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 9
Published : 12/01/1995

History

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