JEDEC JESD51-7 PDF

JEDEC JESD51-7 PDF

Name:
JEDEC JESD51-7 PDF

Published Date:
02/01/1999

Status:
Active

Description:

HIGH EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD FOR LEADED SURFACE MOUNT PACKAGES

Publisher:
JEDEC Solid State Technology Association

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

SKU:

Choose Document Language:
$15.9
Need Help?
This fixturing further defines the environment for thermal test of packaged microelectronic devices. Its function is to provide an alternate mounting surface for the analysis of heat flow in electronic components. The objective of the standard is to provide a high effective thermal conductivity mounting surface that can be compared equally against standard tests done in different laboratories with typical variations of less than or equal to 10%.
File Size : 1 file
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 12
Published : 02/01/1999

History


Related products

JEDEC JESD15-1.01
Published Date: 01/01/2023
COMPACT THERMAL MODEL OVERVIEW
Free Download
JEDEC JESD51-10
Published Date: 07/01/2000
TEST BOARDS FOR THROUGH-HOLE PERIMETER LEADED PACKAGE THERMAL MEASUREMENTS
$16.8
JEDEC JESD51-11
Published Date: 06/01/2001
TEST BOARDS FOR THROUGH-HOLE AREA ARRAY LEADED PACKAGE THERMAL MEASUREMENT
$17.7
JEDEC JESD51-12.01
Published Date: 11/01/2012
GUIDELINES FOR REPORTING AND USING ELECTRONIC PACKAGE THERMAL INFORMATION
$21.6

Best-Selling Products

Basic Fluid Mechanics
Published Date: 08/01/2000
$25.5