DOD DODI-4525.7 PDF

Published Date: 03/01/1980

CONNECTORS, ELECTRICAL, CIRCULAR, MINIATURE, HIGH DENSITY, QUICK DISCONNECT (BAYONET, THREADED, AND BREECH COUPLING), ENVIRONMENT RESISTANT, REMOVABLE CRIMP AND HERMETIC SOLDER CONTACTS, RECEPTACLE, WELD MOUNTING HERMETIC, BREECH COUPLING, HERMETIC SOLDER CONTACTS SERIES IV, METRIC(S/S BY MIL-DTL-38

Published Date: 05/02/2001

NONAPPROPRIATED FUND (NAF) PROCUREMENT POLICY

Published Date: 06/21/2005

INFORMATION ASSURANCE (IA) POLICY FOR SPACE SYSTEMS USED BY THE DEPARTMENT OF DEFENSE

Published Date: 09/20/2004

Letter symbols to be used in electrical technology - Control technology

Published Date: 06/06/2007

International Electrotechnical Vocabulary - Part 732: Computer network technology

Published Date: 04/29/2009

Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems

Published Date: 04/27/2004

Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage