SN-CEN/TR 17172:2018 PDF

SN-CEN/TR 17172:2018 PDF

Name:
SN-CEN/TR 17172:2018 PDF

Published Date:
09/19/2018

Status:
Active

Description:

Validation testing program on chloride penetration and carbonation standardized test methods

Publisher:
Standards Norway SN-CEN/TR Series

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Czech version):
200 business days

SKU:
sn-cen-tr-17172-2018_2525538

Choose Document Language:
0
Need Help?
ADOPTED_FROM:CEN/TR 17172:2018 The objective of the document consists in testing concrete mixes complying with EN 206 for particular aggressive environments with the test methods being standardized by TC 51/WG 12 on chloride penetration and carbonation in order to verify their robustness and coherence.
Number of Pages : 52
Published : 09/19/2018

History

SN-CEN/TR 17172:2022
Published Date: 07/01/2022
Validation testing program on chloride penetration and carbonation standardized test methods
SN-CEN/TR 17172:2018
Published Date: 09/19/2018
Validation testing program on chloride penetration and carbonation standardized test methods

Related products


Best-Selling Products

IEC/PAS 60027-6 Ed. 1.0 en:2004
Published Date: 09/20/2004
Letter symbols to be used in electrical technology - Control technology
12.60 €
IEC/PAS 60050-732 Ed. 1.0 b:2007
Published Date: 06/06/2007
International Electrotechnical Vocabulary - Part 732: Computer network technology
61.20 €
IEC/PAS 60092-510 Ed. 1.0 en:2009
Published Date: 04/29/2009
Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems
89.70 €
IEC/PAS 60099-7 Ed. 1.0 en:2004
Published Date: 04/27/2004
Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341
95.10 €
IEC/PAS 60191-6-18 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
29.10 €
IEC/PAS 60191-6-19 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage
32.10 €