Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages-Design guide for gull-wing lead terminals
Document status: Active
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages-Design guide for fine-pitch land grid array (FLGA). Rectangular type
Document status: Active
Mechanical standardization of semiconductor devices-General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guidelines for fine-pitch land grid array (FLGA)
Document status: Active
Mechanical standardization of semiconductor devices-Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
Document status: Active
Mechanical standardization of semiconductor devices-General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA)
Document status: Active
Mechanical standardization of semiconductor devices-Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
Document status: Active
Mechanical standardization of semiconductor devices-General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline J-lead packages (SOJ)
Document status: Active
Mechanical standardization of semiconductor devices-General rules for the preparation of outline drawings of surface mounted semiconductor device packages
Document status: Active
Mechanical standardization of semiconductor devices-General rules for the preparation of outline drawings of surface mounted semiconductor device packages
Document status: Active
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages-Measuring methods for package dimensions of ball grid array (BGA)
Document status: Active
