Mechanical standardization of semiconductor devices Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
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Mechanical standardization of semiconductor devices Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
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Mechanical standardization of semiconductor devices Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
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Mechanical standardization of semiconductor devices Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
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Mechanical standardization of semiconductor devices Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)
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Mechanical standardization of semiconductor devices Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)
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Mechanical standardization of semiconductor devices Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
Document status: [ Active ]
Low pressure sodium vapour lamps - Performance requirements
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Hydraulic turbines, storage pumps and pump-turbines - Model acceptance tests
Document status: [ Revised ]
Printed board design, manufacture and assembly - Terms and definitions
Document status: [ Withdrawn ]
