Semiconductor devices - Micro-electromechanical devices Part 11: Test method for coefficients of linear thermal expansion of freestanding materials for micro-electromechanical systems
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Semiconductor devices - Microelectromechanical devices Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
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Semiconductor devices - Microelectromechanical devices Part 13: Bend - and shear - type test methods of measuring adhesive strenght for MEMS structures
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Semiconductor devices - Micro-electromechanical devices Part 14: Forming limit measuring method of metallic film materials
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Dispositivi a semiconduttore - Dispositivi microelettromeccanici Parte 15: Metodi di prova della resistenza di connessione tra PDMS e vetro
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Semiconductor devices - Micro-electromechanical devices Part 15: Test method of bonding strength between PDMS and glass
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Semiconductor devices - Micro-electromechanical devices Part 15: Test method of bonding strength between PDMS and glass
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Semiconductor devices - Micro-electromechanical devices Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods
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Semiconductor devices - Micro-electromechanical devices Part 17: Bulge test method for measuring mechanical properties of thin films
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Semiconductor devices - Micro-electromechanical devices Part 18: Bend testing methods of thin film materials
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