Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2-801: Thermal conductivity test for base materials
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2-803: Test methods for Z-axis expansion of base materials and printed boards
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Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-804: Test methods for time to delamination – T260, T288, T300
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2-805: X/Y CTE test for thin base materials by TMA
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA
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Test Methods For Electrical Materials, Printed Board And Other Interconnection Structures And Assemblies - Part 2-808: Thermal Resistance Of An Assembly By Thermal Transient Method
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Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
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Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
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