Workmanship requirements for soldered electronic assemblies - Part 1: General
Document status: [ Withdrawn ]
Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
Document status: [ Withdrawn ]
Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies
Document status: [ Withdrawn ]
Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
Document status: [ Withdrawn ]
Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies
Document status: Active
Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies
Document status: Active
Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies
Document status: Active
Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies
Document status: Active
Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages
Document status: Active
Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
Document status: Active
