CERAMIC PACKAGE SPECIFICATION FOR MICROELECTRONIC PACKAGES
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Compute Express Link (CXL™) Memory Module Base Standard
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Compression Attached Memory Modu le (CAMM2) Common Standard, Version 1.02
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GENERAL REQUIREMENTS FOR DISTRIBUTORS OF COMMERCIAL AND MILITARY SEMICONDUCTOR DEVICES
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CONDITIONS FOR MEASUREMENT OF DIODE STATIC PARAMETERS
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NUMBERING OF LIKE-NAMED TERMINAL FUNCTIONS IN SEMICONDUCTOR DEVICES AND DESIGNATION OF UNITS IN MULTIPLE-UNIT SEMICONDUCTOR DEVICES
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ADDENDUM No. 1 to JESD35 - GENERAL GUIDELINES FOR DESIGNING TEST STRUCTURES FOR THE WAFER-LEVEL TESTING OF THIN DIELECTRICS
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ADDENDUM No. 2 to JESD35 - TEST CRITERIA FOR THE WAFER-LEVEL TESTING OF THIN DIELECTRICS
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PROCEDURE FOR WAFER-LEVEL-TESTING OF THIN DIELECTRICS
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THE MEASUREMENT OF TRANSISTOR NOISE FIGURE AT FREQUENCIES UP TO 20 kHz BY SINUSOIDAL SIGNAL-GENERATOR METHOD
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