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IEC 60749-20-1 Ed. 1.0 b:2009 PDF

IEC 60749-20-1 Ed. 1.0 b:2009 PDF

Name:
IEC 60749-20-1 Ed. 1.0 b:2009 PDF

Published Date:
04/07/2009

Status:
[ Withdrawn ]

Description:

Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

Publisher:
International Electrotechnical Commission

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$70.5
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IEC 60749-20-1:2009 applies to all non-hermetic SMD packages which are subjected to reflow solder processes and which are exposed to the ambient air. The purpose of this document is to provide SMD manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow sensitive SMDs which have been classified to the levels defined in IEC 60749-20. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe and damage-free reflow can be achieved, with the dry packing process, providing a minimum shelf life capability in sealed dry-bags from the seal date.
Edition : 1.0
File Size : 1 file , 1.1 MB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 63
Published : 04/07/2009

History

IEC 60749-20-1 Ed. 3.0 b:2020
IEC 60749-20-1 Ed. 3.0 b:2020
Published Date: 08/31/2020
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
$59.7
IEC 60749-20-1 Ed. 2.0 b:2019
IEC 60749-20-1 Ed. 2.0 b:2019
Published Date: 06/26/2019
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
$98.7
IEC 60749-20-1 Ed. 1.0 b:2009
IEC 60749-20-1 Ed. 1.0 b:2009
Published Date: 04/07/2009
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
$70.5

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