JEDEC JESD22-B106D PDF

JEDEC JESD22-B106D PDF

Name:
JEDEC JESD22-B106D PDF

Published Date:
04/01/2008

Status:
Active

Description:

RESISTANCE TO SOLDER SHOCK FOR THROUGH-HOLE MOUNTED DEVICES

Publisher:
JEDEC Solid State Technology Association

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

This method established a standard procedure for determining whether through-hole solid state devices can withstand the effects of the temperature to which they will be subject during soldering of their leads. This revision updates the references to currently military standards.

File Size :	1 file , 70 KB
Note :	This product is unavailable in Ukraine, Russia, Belarus
Number of Pages :	12
Published :	04/01/2008

History

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Package Warpage Measurement of Surface-Mount Integrated Circuits at Elevated Temperature

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