JEDEC JESD78F.02 PDF

This standard establishes the procedure for testing, evaluation and classification of devices and microcircuits according to their susceptibility (sensitivity) to damage or degradation by exposure to a defined latch-up stress. This standard covers a current-injection test (Signal Pin Test) and an overvoltage test (Supply Test). Current injection is achieved either by current forcing with voltage compliance limit (I-Test) or by applying voltage with current compliance limit (E-Test).

All packaged semiconductor devices, thin film circuits, surface acoustic wave (SAW) devices, optoelectronic devices, hybrid integrated circuits (HICs), and multi-chip modules (MCMs) containing any of these devices are to be evaluated according to this standard. This test method is applicable to NMOS, CMOS, bipolar, and all variations and combinations of these technologies including some Silicon-On-Insulator (SOI).