Publisher : DANSK

DANSK DSF/PREN IEC 61169-70 PDF

Radio-frequency connectors Part 70: Sectional specification for series HD-BNC radio-frequency coaxial connectors – Characteristic Impedance 75 ohms

Document status: [ Draft-Obsolete ]

12.00 €
DANSK DSF/PREN IEC 61188-6-1 PDF

Circuit boards and circuit board assemblies – Design and use – Part 6-1: Land pattern design – Generic requirements for land pattern on circuit boards

Document status: [ Draft-Obsolete ]

12.00 €
DANSK DSF/PREN IEC 61188-6-2 PDF

Circuit boards and circuit board assemblies – Design and use – Part 6-2: Land pattern design – Description of land pattern for the most common surface mounted components (SMD)

Document status: [ Draft-Obsolete ]

12.00 €
DANSK DSF/PREN IEC 61188-6-3 PDF

Circuit boards and circuit board assemblies – Design and use – Part 6-3: Land pattern design – Description of land pattern for through hole components (THT)

Document status: [ Draft ]

12.00 €
DANSK DSF/PREN IEC 61189-2-501 PDF

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-501: Test methods for materials for interconnection structures – Measurement of Resilience strength and Resilience strength Retention Factor of Flexible Dielectric Materials

Document status: [ Draft-Obsolete ]

8.70 €
DANSK DSF/PREN IEC 61189-2-720 PDF

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-720: Detection of defects in interconnection structures by measurement of capacitance

Document status: [ Draft ]

8.70 €
DANSK DSF/PREN IEC 61189-2-801 PDF

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-801: Thermal conductivity test for base materials

Document status: [ Draft-Obsolete ]

8.70 €
DANSK DSF/PREN IEC 61189-2-803 PDF

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-803: Test methods for Z-Axis Expansion of base materials and printed board

Document status: [ Draft-Obsolete ]

8.70 €
DANSK DSF/PREN IEC 61189-2-804 PDF

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-804: Test methods for time to delamination – T260, T288, T300

Document status: [ Draft ]

8.70 €
DANSK DSF/PREN IEC 61189-2-805 PDF

Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-805: X/Y CTE Test for Thin Base Materials by TMA

Document status: [ Draft-Obsolete ]

8.70 €