Integrated circuits. Three dimensional integrated circuits-Alignment of stacked dies having fine pitch interconnect
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Nuclear power plants. Electrical power system. General requirements
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Semiconductor devices. Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices-Classification of defects
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Semiconductor devices. Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices-Test method for defects using optical inspection
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Semiconductor devices. Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices-Test method for defects using photoluminescence
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Radiation protection instrumentation. System of spectral identification of liquids in transparent and semitransparent containers (Raman systems)
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Eyewear display-Fundamental measurement methods. Optical properties
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Eyewear display-Fundamental measurement methods. Image quality
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Connectors for electrical and electronic equipment-Detail specification for shielded or unshielded, free and fixed connectors with up to 8 ways for balanced single-pair data transmission with current carrying capacity. Mechanical mating information, pin assignment and additional requirements for Type 4
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