ECIA 364-56A PDF

Purpose

This test is performed for the purpose of determining whether connectors can withstand the effects of the heating and/or environment to which they will be subjected during the soldering of their terminations by solder dip, soldering iron, solder wave, or reflow soldering techniques. The heat and/or environment of soldering may affect the electrical characteristics of the connector and may cause damage to the materials making up the connector. It may also result in loosening of terminations, softening or distortion of insulation materials, opening of solder seals, weakening of mechanical joints, etc.