Name:
ECIA EIA/ECA-364-56B PDF
Published Date:
04/01/2005
Status:
[ Revised ]
Publisher:
Electronic Components Industry Association
This standard establishes a test method for determining whether connectors can withstand the effects of the heating and/or environment that they will be subjected to during the soldering of their terminations by solder dip, soldering iron, solder wave, or reflow soldering techniques.
| Edition : | B |
| File Size : | 0 files |
| Number of Pages : | 20 |
| Published : | 04/01/2005 |